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Module dispensing process - gluing and filling system solutions

Module dispensing process - gluing and filling system solutions

2025-09-29 09:06

Era by era changes, camera products are also upgrading, the front has also added anti-shake function, and also enables dual camera configuration, the rear camera is more powerful, telephoto, macro, wide-angle, high pixels and even up to 100 million pixels, can shoot stars and moon, a variety of shooting scenarios optimization, in addition to software optimization, hardware needs to be more powerful configuration, VCM, CCM, vibration motor, MEMS, side buttons and other dispensing process requirements are also getting higher and higher, not only in efficiency, but also in quality, There is a qualitative improvement.





Common applications are:

VCM

The dispensing process enables small volume VCMs





Voice coil motors are mainly used in small-stroke, high-speed, and high-acceleration movements, and are suitable for use in small spaces. The most common application is the camera of a smartphone. The VCM motor adjusts the position of the lens to change the focal length so that the camera is at its sharpest. VCM production involves a large number of dispensing processes.


Process characteristics

Typical dispensing applications in the VCM process include: F-spring dispensing, B-spring bonding, tap-wire & terminal spot solder paste, base pre-bonding, terminal PIN bonding, and housing four-sided (corner) pre-bonding. Due to the small size of the product and the large output, VCM is a small amount of precision dispensing, which requires high efficiency.

There are professional solutions and perfect technical solutions in VCM dispensing process;



CCM

The glue process makes the camera module more miniaturized and the image quality better.






The dispensing process is indispensable in the camera process. The dispensing process in the production of camera modules is ubiquitous: the bonding between various components, the fixation of the lens, the reinforcement of the flexible board, the protection of the soldering joints of the motor pins, the fixing of the dual camera and triple camera brackets, and the dust and water resistance of the module are all completed by dispensing.


Process characteristics

With the progress of society, people's requirements for CCM camera image quality are getting higher and higher, the size of photosensitive chips and lenses is getting larger and larger, the volume of the module is relatively fixed, and the position left for dispensing is getting smaller and smaller, and the accuracy requirements for the dispensing system are constantly improving. Module factories are all mass-produced, and the shipment volume is calculated in KK, and the dispensing efficiency is crucial.


VERMES piezoelectric microjetting system can achieve faster efficiency and smaller point diameter; with the powerful visual algorithm library in terms of software, it can easily complete accurate and fast positioning and grasping of products of different shapes and materials.


Vibration motor

The reason why mobile phones can vibrate mainly depends on the vibration motor inside the mobile phone.






As mobile phones become thinner and lighter, they also require smaller and more compact internal components.

On the one hand, the glue can be more reliable, and on the other hand, the glue can be applied to the narrow gaps, so there is no need to worry about its stability when the motor is relatively small. At the same time, coating glue on the vibration motor can protect the welding joints and small parts, play a role in waterproofing and extending the service life.


Process characteristics

Taking the button vibration motor as an example, the dispensing process applied in the button vibration motor is briefly described. The button motor needs to go through four dispensing processes, namely small component encapsulation, chip bonding reinforcement, solder encapsulation, and FPC reinforcement.

Due to the small volume of the vibration motor product itself and the limited internal space, the encapsulation requirements for components are different from our common component encapsulation process. It only needs to enclose a part of the component in a specific position, during which it is necessary to ensure strict dispensing volume control and accurate dispense position control.

The solder encapsulation process is more difficult. Due to the inconsistency of the size of the solder and the certain deviation in the position, if the conventional point encapsulation method is adopted, it is very easy to cause the solder joint to be sealed and overflow, resulting in poor dispensing.

In view of the above situation, based on the long-term accumulated dispensing experience, the method of combining dots and lines is adopted to help customers solve the problem of overflow and poor sealing.

When it comes to vibration motor dispensing, valves and software handling systems are at the heart of dispensing a wide range of fluids and adhesives at high speeds and controllable volumes.



Silicon Macs MEMS

Dispensing improves the microphone's drop resistance, water resistance, and sound quality.







With the rapid development of the MEMS industry, MEMS applications are becoming more and more widespread, consumer products are not only limited to availability, but also require durability, good quality, MEMS has also introduced the dispensing process, MEMS mainly involves IC encapsulation, dot solder paste, etc.


Process characteristics

The IC encapsulation process requires glue to cover the chip and solder joints, which plays a reinforcing role in reinforcing the chip and solder joints, preventing the chip and solder joints from falling off, and improving the product life and stability.

The MEMS tin spotting process requires a circle of solder paste around the substrate, requiring uniform glue circuit and no glue breakage, the process is mainly to weld the metal cover and the substrate together, the metal cover can improve the anti-RF interference ability, improve the sound quality of the product.

IC encapsulation, it is recommended to use piezoelectric valves, high efficiency, and accurate glue control; for tin dispensing process, it is recommended to use screw valves. Our WDP series progressive cavity valve is a kind of screw valve with von Haber DC motor as the driving source, using the screw volumetric feeding principle, the screw rotates in the cavity directionally, to realize the axial conveying function of the medium. Through software integration, closed-loop control can be realized, the valve opening time, feeding pressure and screw speed can be adjusted, combined with reverse glue breaking technology, to achieve accurate and repeatable consistent dispensing, to meet different process needs.





Side button dispensing

Side button dispensing improves the stability of the phone







The side button is one of the most frequently used buttons in our daily life, so there are strict requirements for the performance of the button itself, so the dispensing of the side button is particularly important. The underfilling process can be reinforced to prevent falling off, the key encapsulation can prevent the oxidation of the solder joint, and it also plays a certain role in adding fixation.


Process characteristics

The buttons are basically composed of FPC panels, the soft board is easy to deform and shift, and not every product has a fixed and standard mark point, so it is particularly important for visual processing and lighting, in addition, the vision software needs to optimize the algorithm to skip the product-free soft board to improve the efficiency of recognition.

The general dispensing requirements of the side button, the glue cannot appear in the purple area, which will affect the appearance quality; The glue on the two long sides cannot flow under the PCB, and the yellow area in the picture will affect the assembly process.

The side button is one of the most frequently used buttons in our daily life, so there are relatively strict requirements for the performance of the button itself, the underfill reinforcement prevents falling off, and the key encapsulation prevents the oxidation of the solder joint, which also plays a certain role in adding fixation.

We have accumulated many years of application experience in mobile phone 3C dispensing applications, and have mature and stable products and solutions.







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